ISR research accomplishments
Parallel Fabrication of 3-Dimensional Microstructures
Research team
D. DeVoe (ME/ISR), L. W. Tsai (ME/ISR), W. Cheng, C. Kimball, J. Maloney, D. Shreiber, F. Rosenberger
Accomplishment
3DMEMS technology
for silicon-based spatial micromechanisms.
3-dimensional motion. Large workspaces ~ (500mm)3. Mechanically robust. Compliant and non-compliant kinematic pairs. On-chip actuation. Integrated CMOS. First demonstration of mechanically-robust silicon micromechanisms. DARPA-funded effort with military insertion opportunities across a wide range of integrated systems. Applications for microphotonics, microrobotics, surgical and biosample manipulation, and microanalysis sample positioning.
For more information
Z.X. Liu, D.L. DeVoe, “Silicon
fusion bonding for three-dimensional MEMS,” J. Micromechanics
and microengineering, submitted January 2000
C. Kimball, L.W. Tsai, D. DeVoe, J. Maloney, "Modeling and batch fabrication of spatial micro-manipulators," ASME 2000 Design Engineering Technical Conference, submitted February 2000
